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  APTLGT300A1208G APTLGT300A1208G C rev 1 october, 2012 www.microsemi.com 1-7 out 0/vbus vbus gndvdd gnd inl vdd inh these devices are sens itive to electrostatic discharge. proper handling procedures should be follow ed. see application note apt0502 on www.microsemi.com v ces = 1200v i c = 300a @ tc = 80c phase leg intelligent power module application ? motor control ? uninterruptible power supplies ? switched mode power supplies ? amplifier features ? trench + field stop igbt 3 technology - low voltage drop - low tail current - soft recovery parallel diodes - low diode vf - low leakage current - rbsoa and scsoa rated ? integrated fail safe igbt protection (driver ) - top bottom input signals interlock - isolated dc/dc converter ? low stray inductance ? m5 power connectors ? high level of integration benefits ? outstanding performance at high frequency operation ? stable temperature behavior ? very rugged ? direct mounting to heatsink (isolated package) ? low junction to case thermal resistance ? very high noise immunity (common mode rejection > 25kv/s) ? galvanic isolation: 3750v for the optocoupler 2500v for the transformer ? 5v logic level with schmitt-trigger input ? single v dd =5v supply required ? secondary auxiliary power supplies internally generated (15v, -6v) ? optocoupler qualified to aec-q100 test guidelines ? rohs compliant downloaded from: http:///
APTLGT300A1208G APTLGT300A1208G C rev 1 october, 2012 www.microsemi.com 2-7 all ratings @ t j = 25c unless otherwise specified 1. inverter power module absolute maximum ratings symbol parameter max ratings unit v ces collector - emitter breakdown voltage 1200 v t c = 25c 440 i c continuous collector current t c = 80c 300 i cm pulsed collector current t c = 25c 600 a p d maximum power dissipation t c = 25c 1400 w rbsoa reverse bias safe operating area t j = 125c 600a @ 1150v electrical characteristics symbol characteristic test conditions min typ max unit t j = 25c 500 i ces zero gate voltage collector current v ge = 0v v ce = 1200v t j = 125c 750 a t j = 25c 1.7 2.1 v ce(sat) collector emitter saturation voltage v dd = v in = 5v i c = 300a t j = 125c 2 v dynamic characteristics symbol characteristic test conditions min typ max unit c ies input capacitance 21 c oes output capacitance 1.12 c res reverse transfer capacitance v ge = 0v v ce = 25v f = 1mhz 0.96 nf t r rise time 40 t f fall time inductive switching (25c) v dd = v in = 5v v bus = 600v ; i c = 300a 70 ns t r rise time 45 t f fall time 90 ns e on turn-on switching energy 28 e off turn-off switching energy inductive switching (125c) v dd = v in = 5v v bus = 600v i c = 300a 32 mj i sc short circuit data v dd = v in = 5v; v bus =900v t p 10s ; t j = 125c 1200 a r thjc junction to case thermal resistance 0.09 c/w downloaded from: http:///
APTLGT300A1208G APTLGT300A1208G C rev 1 october, 2012 www.microsemi.com 3-7 reverse diode ratings and characteristics symbol characteristic test conditions min typ max unit v rrm maximum peak repetitive reverse voltage 1200 v t j = 25c 250 i rm maximum reverse leakage current v r =1200v t j = 125c 500 a i f dc forward current tc = 80c 300 a t j = 25c 1.6 2.1 v f diode forward voltage i f = 300a t j = 125c 1.6 v t j = 25c 170 t rr reverse recovery time t j = 125c 280 ns t j = 25c 28 q rr reverse recovery charge t j = 125c 56 c t j = 25c 12 e rr reverse recovery energy i f = 300a v r = 600v di/dt =3500a/s t j = 125c 22 mj r thjc junction to case thermal resistance 0.16 c/w 2. driver absolute maximum ratings symbol parameter max ratings unit v dd supply voltage 5.5 v ini input signal voltage i=l, h 5.5 v v ini = 0v, i =l & h 0.35 i vddmax maximum supply current v dd =5v, v inh = /v inl ; f out = 45khz 2 a f max maximum switching frequency 45 khz driver electrical characteristics symbol characteristic test conditions min typ max unit v dd operating supply voltage 4.5 5 5.5 v v ini(max) maximum input voltage -0.5 5 5.5 v ini (th+) positive going threshold voltage 3.2 v ini(th-) negative going threshold voltage 1 v r ini input resistance * i = l, h 1 k ? t d(on) turn on delay time driver + igbt 1100 ? d t built in dead time 600 t d(off) turn off delay time driver + igbt 750 ns pwd pulse width distortion 300 pdd propagation delay difference between any two driver t d(on) - t d(off) -350 350 ns v isol primary to secondary isolation 2500 v rms * low impedance guarantees good noise immunity. ? including built in dead time. downloaded from: http:///
APTLGT300A1208G APTLGT300A1208G C rev 1 october, 2012 www.microsemi.com 4-7 3. package characteristics symbol characteristic min typ max unit v isol rms isolation voltage, any terminal to case t =1 min, 50/60hz 4000 v t j operating junction temperature range -40 150 t op operating ambient temperature -40 85 t stg storage temperature range -40 100 t c operating case temperature -40 100 c to heatsink m5 2 4.7 torque mounting torque for terminals m5 2 4 n.m wt package weight 550 g 4. lp8 package outline (dimensions in mm) downloaded from: http:///
APTLGT300A1208G APTLGT300A1208G C rev 1 october, 2012 www.microsemi.com 5-7 typical igbt performance curve output characteristics (v ge =15v) t j =25c t j =125c 0 100 200 300 400 500 600 01234 v ce (v) i c (a) v dd = 5v v in = 5v energy losses vs collector current eon eoff 0 8 16 24 32 40 48 56 64 0 100 200 300 400 500 600 i c (a) e (mj) v ce = 600v v dd = 5v v in = 5v t j = 125c reverse bias safe operating area 0 100 200 300 400 500 600 700 0 400 800 1200 v ce (v) i c (a) t j =125c maximum effective transient thermal impedance, junction to case vs pulse duration d = 0.9 0.7 0.5 0.3 0.1 0.05 single pulse 0 0.02 0.04 0.06 0.08 0.1 0.00001 0.0001 0.001 0.01 0.1 1 10 rectangular pulse duration (seconds) thermal impedance (c/w) hard switching 0 10 20 30 40 50 0 80 160 240 320 400 480 i c (a) fmax, operating frequency (khz) v ce =600v d=50% v dd = 5v v in = 5v t j =125c t c =75c operating frequency vs collector current limited by internal gate drive power dissipation downloaded from: http:///
APTLGT300A1208G APTLGT300A1208G C rev 1 october, 2012 www.microsemi.com 6-7 typical diode performance curve energy losses vs collector current 5 10 15 20 25 30 0 100 200 300 400 500 600 i f (a) err (mj) v r = 600v t j = 125c forward characteristic of diode t j =25c t j =125c 0 100 200 300 400 500 600 0 0.4 0.8 1.2 1.6 2 2.4 v f (v) i f (a) maximum effective transient thermal impedance, junction to case vs pulse duration d = 0.9 0.7 0.5 0.3 0.1 0.05 single pulse 0 0.04 0.08 0.12 0.16 0.2 0.00001 0.0001 0.001 0.01 0.1 1 10 rectangular pulse duration (seconds) thermal impedance (c/w) downloaded from: http:///
APTLGT300A1208G APTLGT300A1208G C rev 1 october, 2012 www.microsemi.com 7-7 disclaimer the information contained in the document (unless it is publicly available on the web without access restrictions) is proprietary and confidential information of microsemi and cannot be copied, published, uploaded, posted, transmitted, distributed or disclosed or used without the express duly signed written consent of microsemi. if the recipient of this document has entered into a disclosure agreement with microsemi, then the ter ms of such agreement will also apply. this document and the information contained herein may not be modified, by any person other than authorized personnel of microsemi. no license under any patent, copyright, trade secret or other intellectual property right is granted to or conferred upon you by disclosure or delivery of the information, either expressly, by implication, inducement, estoppels or otherwise. any license under such intellectual property rights must be approved by microsemi in writing signed by an officer of microsemi. microsemi reserves the right to change the configuration, functionality and performance of its products at anytime without any notice. this product has been subject to limited testing and should not be used in conjunction with li fe- support or other mission-critical equipment or applications. microsemi assumes no liability whatsoever, and microse mi disclaims any express or implied warranty, relating to sale and/or use of microsemi products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. any performance specifications believed to be reliable but are not verified and customer or user must conduct and complete all performance and other testing of this product as well as any user or customers final application. user or customer shall not rely on any data and performance specifications or parameters provided by microsemi. it is the customers and users responsibility to independently determine suitability of any microsemi product and to test and verify the same. the information contained herein is provided as is, where is and with all faults, and the entire risk associated with such information is entirely with the user. microsemi specifically disclaims any liability of any kind including for consequential, incidental and punitive damages as well as lost profit. the product is subject to other terms and conditions which can be located on the web at http://www.microsemi.com/legal/tnc.asp life support application seller's products are not designed, intended, or authorized for use as components in systems intended for space, aviation, surgical implant into the body, in other applications intended to support or sustain life, or for any other application in which the failure of the seller's product could create a situation where personal injury, death or property damage or loss may occur (collectively "life support applications"). buyer agrees not to use products in any life support applications and to the extent it does it shall conduct extensive testing of the product in such applications and further agrees to indemnify and hold seller, and its officers, employees, subsidiaries, affiliates, agents, sales representatives and distributors harmless against all claims, costs, damages and expenses, and attorneys' fees and costs arising, directly or directly, out of any claims of personal injury, death, damag e or otherwise associated with the use of the goods in life support applications, even if such claim includes allegations that seller was negligent regarding the design or manufacture of the goods. buyer must notify seller in writing before using sellers products in life support applications. seller will study with buyer alternative solutions to meet buyer application specification based on sellers sales conditions applicable for the new proposed specific part. downloaded from: http:///


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